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CUS15I30A
TOSHIBA Schottky Barrier Rectifier Schottky Barrier Type
CUS15I30A
Switching Mode Power Supply Applications Portable Equipment Battery Applications
* * * * Forward voltage: VFM = 0.46 V (max) @ IF = 1.5 A Repetitive peak reverse voltage: VRRM = 30 V Suitable for high-density board assembly due to the use of a small surface-mount package, "US-FLATTM"
2.5 0.2 1.9 0.1
Unit: mm
1.25 + 0.2 - 0.1 0.88 0.1 0.13 + 0.05 - 0.03
Forward current (AV): IF (AV) = 1.5 A
0.6 0.1 0.6 0.1
Absolute Maximum Ratings (Ta = 25C)
Characteristics Repetitive peak reverse voltage Forward current (AV) Peak one cycle surge forward current (non-repetitive) Junction temperature Storage temperature Symbol VRRM IF (AV) IFSM Tj Tstg Rating 30 1.5 (Note 1) 20 (50 Hz) 150 -55 to 150 Unit V A A C C
0.88 0.1
0 ~ 0.05
1.4 0.2 0.78 0.1 0.6 0.1
0.6 0.1
0.5 0.1
ANODE CATHODE
JEDEC JEITA TOSHIBA
3-2B1A
Note 1: Ta = 68C : Device mounted on a ceramic board Board size : 50 mm x 50 mm Soldering size : 2 mm x2 mm Rectangular waveform ( = 180), VR = 15 V
Weight: 0.004 g (typ.)
Note 2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc).
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CUS15I30A
Electrical Characteristics (Ta = 25C)
Characteristics Symbol VFM (1) Peak forward voltage VFM (2) VFM (3) Repetitive peak reverse current Junction capacitance Test Condition IFM = 0.1 A (pulse test) IFM = 1.0 A (pulse test) IFM = 1.5 A (pulse test) Min Typ. 0.27 0.37 0.40 10 20 50 Max 0.46 60 A pF V Unit
IRRM (1) VRRM = 5.0 V (pulse test) IRRM (2) VRRM = 30 V (pulse test) Cj VR = 10 V, f = 1.0 MHz Device mounted on a ceramic board (board size: 50 mm x 50 mm) (soldering land: 2 mm x 2 mm) (board thickness: 0.64 mm) Device mounted on a glass-epoxy board (board size: 50 mm x 50 mm) (soldering land: 6 mm x 6 mm) (board thickness: 1.6 mm)
75 C/W
Thermal resistance (junction to ambient)
Rth (j-a)
150
Thermal resistance (junction to lead)
Rth (j-)
30
C/W
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Marking
Part No.(or abbreviation code) Abbreviation Code 8 Part No. CUS15I30A Cathode Anode
8
Standard Soldering Pad
Cathode mark and Lot code
Unit: mm 2.0 0.5 0.8
1.1
0.8
Handling Precaution
Schottky barrier diodes have reverse current characteristics compared to other diodes. There is a possibility SBD may cause thermal runaway when it is used under high temperature or high voltage. Please take forward and reverse loss into consideration during design. The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded,even for a moment. Do not exceed any of these ratings. The following are the general derating methods that we recommend when you design a circuit with a device. VRRM: Use this rating with reference to the above. VRRM has a temperature coefficient of 0.1%/C. Take this temperature coefficient into account designing a device at low temperature.
IF(AV) : We recommend that the worst case current be no greater than 80% of the absolute maximum rating of IF(AV) and Tj be below 120C. When using this device, take the margin into consideration by using an allowable Ta max-IF(AV) curve. IFSM: This rating specifies the non-repetitive peak current. This is only applied for an abnormal operation, which seldom occurs during the lifespan of the device. Derate this rating when using a device in order to ensure high reliability. We recommend that the device be used at a Tj of below 120C.
Tj:
Thermal resistance between junction and ambient fluctuates depending on the device's mounting condition. When using a device, design a circuit board and a soldering land size to match the appropriate thermal resistance value. Please refer to the Rectifiers databook for further information.
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iF - vF (A)
10 Pulse test 3 Tj = 150C 1 125C 75C 0.3 25C 0.1 1.0
PF (AV) - IF (AV)
DC 0.8 180 0.6 = 60 0.4 Rectangular waveform 120
Instantaneous forward current
Average forward power dissipation PF (AV) (W)
iF
0.03
0.2
0 360 Conduction angle 0.5 1.0 1.5 2.0 2.5
0.01
0
0.2
0.4
0.6
0.8
1.0
0 0.0
Instantaneous forward voltage vF
(V)
Average forward current
IF (AV) (A)
50 mm x 50 mm, soldering land: 2 mm x 2 mm)
160 140 120 100 80 = 60 60 40 20 0 0.0
0 360 IF (AV)
Conduction angle Rectangular waveform
Ta max - IF (AV) Ceramic substrate (substrate size:
Ta max - IF (AV) Glass-epoxy substrate (substrate size: 50 mm x 50 mm, soldering land: 6 mm x 6 mm)
160 140
Rectangular waveform
Maximum allowable temperature Ta max (C)
Maximum allowable temperature Ta max (C)
120 100 80 60 40 20 0 0.0 = 60 120 180
0 360 IF (AV)
Conduction angle
VR = 15 V
120
180
DC
DC
VR = 15 V
0.5
1.0
1.5
2.0
2.5
0.5
1.0
1.5
2.0
2.5
Average forward current
IF (AV) (A)
Average forward current
IF (AV) (A)
T max - IF (AV)
160 10000
rth (j-a) - t
(2) Device mounted on a glass-epoxy board: board size:50 mm x 50 mm Soldering land: 6.0 mm x 6.0 mm board thickness:1.6 mm (3) Device mounted on a glass-epoxy board: Board size: 50 mm x 50 mm Standard Soldering pad board thickness:1.6 mm
Maximum allowable lead temperature T max (C)
140 120 100 80 60 40 20 0 0.0
0 360 IF (AV)
Conduction angle
Transient thermal impedance rth (j-a) (C/W)
1000
(3) (2) (1)
= 60
120
180
DC
100
Rectangular waveform
10
(1) Device mounted on a ceramic board: board size:50 mm x 50 mm Soldering land: 2.0 mm x 2.0 mm board thickness : 0.64 mm
VR = 15 V
0.5
1.0
1.5
2.0
2.5
1 0.001
0.01
0.1
1
10
100
1000
Average forward current
IF (AV) (A)
Time t (s)
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Surge forward current (non-repetitive)
24 1000 Ta = 25C 20 f = 50 Hz
Cj - VR
(typ.)
f = 1 MHz Ta = 25C
IFSM (A)
(pF)
500 300
Peak surge forward current
16
12
Junction capacitance
Cj
100 50 30
8
4
0
1
3
5
10
30
50
100
10 1
3
5
10
30
50
100
Number of cycles
Reverse voltage
VR
(V)
IR - Tj
100 Pulse test 10 20 V 1 15 V 0.1
(typ.)
0.8
PR (AV) - VR Average reverse power dissipation
0.7 0 0.6 Rectangular waveform 360
(typ.)
(mA)
VR = 30 V 3V 5V 10 V
(W)
VR 0.5 0.4 0.3 0.2 0.1 0 60 Conduction angle Tj = 150C 300 240 180 120
DC
Reverse current IR
0.01
0.001
0
20
40
60
80
100
120
140
160
PR (AV)
0
10
20
30
Junction temperature
Tj
(C)
Reverse voltage
VR
(V)
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RESTRICTIONS ON PRODUCT USE
* Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively "Product") without notice. * This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. * Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS. * Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document. Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public impact ("Unintended Use"). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this document. * Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part. * Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. * The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. * ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT. * Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. * Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations.
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